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Reclaim Wafer
Product Features
Substrate damage free chemical solution.
Minimize removal thickness.
Substrate damage free chemical solution.
Minimize removal thickness.
Venfor：Shinryo
Country：Japan
Agency religion：China
Technology of SHINRYO stemmed from MITSUBISHI CHEMICAL. With the highly selective film stripping chemical solution and single wafer type polishing technology, SHINRYO provide high quality reclaim wafers with only (3μm) removal thickness, Let customers gain a greatest benefit.