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Hub Blades
Nickel Hub Blade adopts ultrafine diamond micro-powder electroplated onto an aluminum alloy flange to form an integrated structure, which has very high product precision. In the semiconductor chip cutting process, it not only has a high efficiency but also ensures stable processing quality. On this basis, it has the following characteristics:
1.Various combinations of diamond grit sizes and binder hardnesses can meet the processing requirements of different products.
2.High product precision, significantly reducing precut time
3.Special process, greatly avoiding problems such as blade damage and etc
1.Various combinations of diamond grit sizes and binder hardnesses can meet the processing requirements of different products.
2.High product precision, significantly reducing precut time
3.Special process, greatly avoiding problems such as blade damage and etc
Vendor：Sail
Vendor：China
Wafer(MOSFET/IC/SI/SIC/GaN)，CSP，QFN，DFN，BGA
North
Luke Yu
E-mail: luke@niching.com.tw
TEL: 886-3-6116888 ext.62538
South
Anderson
E-mail: anderson@niching.com.tw
TEL: 886-7-8618808 ext.63602