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Memory
■ FC-BOC
Memory IC substrate used on personal computers or electronic communication products.
■ LGA
The handheld device is equipped with a multi-chip stacked embedded memory module.
■ POP
Memory packaging substrates for smartphones, tablets and mobile devices are used in conjunction with 2D packaging for application processors or baseband chipsets.
■ eMMC/eMCP
IC substrate used for flash memory in smartphones and tablets.
Memory IC substrate used on personal computers or electronic communication products.
■ LGA
The handheld device is equipped with a multi-chip stacked embedded memory module.
■ POP
Memory packaging substrates for smartphones, tablets and mobile devices are used in conjunction with 2D packaging for application processors or baseband chipsets.
■ eMMC/eMCP
IC substrate used for flash memory in smartphones and tablets.
Vendor：SIMMTECH
Country：Korea
Tako Chang
E-mail: tako_chang@niching.com.tw
TEL: 03-6116888 ext.62503