依據歐盟施行的個人資料保護法，我們致力於保護您的個人資料並提供您對個人資料的掌握。
按一下「全部接受」，代表您允許我們置放 Cookie 來提升您在本網站上的使用體驗、協助我們分析網站效能和使用狀況，以及讓我們投放相關聯的行銷內容。您可以在下方管理 Cookie 設定。 按一下「確認」即代表您同意採用目前的設定。
Grinding Wheels
◆Mesh size ：320#~30000#；
◆ Application process: Backside thinning, rough grinding of the front
side and fine grinding, polishing processing
◆ Product characteristics:
1. Porous binder, with higher self-sharpening properties;
2.High feed speed, greatly improving processing efficiency;
3.Unique binder formula, excellent processing quality;
4.Low wheel wear, long service life;
Can be customized according to customer requirements
◆ Application process: Backside thinning, rough grinding of the front
side and fine grinding, polishing processing
◆ Product characteristics:
1. Porous binder, with higher self-sharpening properties;
2.High feed speed, greatly improving processing efficiency;
3.Unique binder formula, excellent processing quality;
4.Low wheel wear, long service life;
Can be customized according to customer requirements
Vendor：Sail
Vendor：China
Mainly used for semiconductor wafer thinning and precision grinding, polishing processing (discrete devices, integrated circuit substrates, and original chips, etc.)
North
Luke Yu
E-mail: luke@niching.com.tw
TEL: 886-3-6116888 ext.62538
South
Anderson
E-mail: anderson@niching.com.tw
TEL: 886-7-8618808 ext.63602