We use cookies to ensure the proper functioning of our website, personalize content and advertisements, provide social media features, and analyze traffic. We also share information about your use of our website with our social media, advertising, and analytics partners.
Grinding Wheels
◆Mesh size ：320#~30000#；
◆ Application process: Backside thinning, rough grinding of the front
side and fine grinding, polishing processing
◆ Product characteristics:
1. Porous binder, with higher self-sharpening properties;
2.High feed speed, greatly improving processing efficiency;
3.Unique binder formula, excellent processing quality;
4.Low wheel wear, long service life;
Can be customized according to customer requirements
◆ Application process: Backside thinning, rough grinding of the front
side and fine grinding, polishing processing
◆ Product characteristics:
1. Porous binder, with higher self-sharpening properties;
2.High feed speed, greatly improving processing efficiency;
3.Unique binder formula, excellent processing quality;
4.Low wheel wear, long service life;
Can be customized according to customer requirements
Vendor：Sail
Vendor：China
Mainly used for semiconductor wafer thinning and precision grinding, polishing processing (discrete devices, integrated circuit substrates, and original chips, etc.)
North
Luke Yu
E-mail: luke@niching.com.tw
TEL: 886-3-6116888 ext.62538
South
Anderson
E-mail: anderson@niching.com.tw
TEL: 886-7-8618808 ext.63602