The Best Solution for Heat-Dissipation
of the Third-Generation Semiconductor Package

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Silver Paste

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DN17 series

Features
1.Low Temperature Cure (>150oC) Hybrid Polymers
2.Proprietary Silver Blend Technology
3.High Electrical and Thermal Conductivities
4.Proven Stability and Reliability Performance
5.High Adhesion on Various Substrate Finishes (ex. Ag, Au, PPF, Cu,Al)
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Package type
  1. Discrete device
  2. High Power LED
  3. PMIC
  4. RF-IC
  5. MOSFET
  6. Power Diode
 
►Traditional Polymer Product Line

 

Contact

張廷宇 Ricky Chang
E-mail:ricky_chang@niching.com.tw
TEL: 03-6116888 ext.535