The Best Solution for Heat-Dissipation
of the Third-Generation Semiconductor Package

Welcome to NICHING INDUSTRAIL CORPORATION

DN17 series

Features
1.Low Temperature Cure (>150oC) Hybrid Polymers
2.Proprietary Silver Blend Technology
3.High Electrical and Thermal Conductivities
4.Proven Stability and Reliability Performance
5.High Adhesion on Various Substrate Finishes (ex. Ag, Au, PPF, Cu,Al)





Package type
  1. Discrete device
  2. High Power LED
  3. PMIC
  4. RF-IC
  5. MOSFET
  6. Power Diode
 
►Traditional Polymer Product Line

 

Contact

張廷宇 Ricky Chang
E-mail:ricky_chang@niching.com.tw
TEL: 03-6116888 ext.535