The Best Solution for Heat-Dissipation
of the Third-Generation Semiconductor Package

Welcome to NICHING INDUSTRAIL CORPORATION

DN18 series

Features
  1. Low Temperature Pressureless Sintering System
  2. Proprietary Resins Assist Sintering Process
  3. Long Open Time for Wider Process Window
  4. Can be applied to large die size reliably through low modulus character
  5. High Adhesion with Ag Sintering on Various Substrate Finishes (ex. Ag, Au, Cu,PPF)




Package type
  1. Discrete device
  2. High Power LED
  3. PMIC
  4. RF-IC
  5. IGBT
  6. MOSFET
  7. Power Diode
 

   ►Resin Filled Sintering Product Line

 

Contact
張廷宇 Ricky Chang
E-mail:ricky_chang@niching.com.tw
TEL: 03-6116888 ext.535