The Best Solution for Heat-Dissipation
of the Third-Generation Semiconductor Package

Welcome to NICHING INDUSTRAIL CORPORATION

DN12 series

Features
  1. Low temperature sintering silver with pressureless process
  2. Pure Ag sintering  products
  3. Long open time, good workability
  4. High thermal conductivity > 150 W/mK
  5. Stable & precise dispensing volume for BLT control
  6. Controlled and homogenous porosity for optimal thermal stress release
  7. Material optimization between die shear strength and modulus
  8. Proprietary in-house nano silver particles technology
  9. Tailor-make to meet customer’s specific needs




Package Type
  1. Discrete device
  2. High Power LED
  3. PMIC
  4. RF-IC
  5. IGBT
  6. MOSFET
  7. Power Diode
 

   

Pure Ag Sintering Product Line

Testing Report (Link here)


Contact

張廷宇 Ricky Chang
E-mail:ricky_chang@niching.com.tw
TEL: 03-6116888 ext.535