Semiconductor Front End
Process Material
Specialty Gas (F2/SF6)
Photo Resist
Al2O3
SiC Powder
Reclaim Wafer
Chemical HF
Quartzware
Specialty Gas (SiF4/C3F8/C4F8/CH3F/CH4)
Specialty Gas (COF2)
Process Equipment
Advanced IPA Dryer
Key Componet
MFC & MFM
FM &FC
The parts of PI & PBI
Facility System
Gas Cabinet
Gas Purifer
Gas Scrubber
Semiconductor Back End
Bonding Tools
Capillary ; Wedge
Die Collet ; Needle
Dispensing Nozzle
Package Material
Substrate for Memory Device
COF TAB Tape for DR IC
LOC Lead Frame
Copper Bonding Wire
QFN Lead Frame
PCB for Memory Module
Marking Materials_PAD
Marking Materials_Aluminum / Iron Plate
Marking Materials_INK / Thinner
Lid for Memory Card
IC Packing
Chip Tray
ABS Reel of COF TAB Tape
Emboss spacer for TAB Tape
The parts of PI & PBI
Wafer
Al Coating Wafer
Daisy Chain Wafer
Dummy Wafer
FPD Industry
LCD Module
Specialty Gas (F2/SF6)
Specialty Gas (NH3)
Specialty Gas (COF2)
LED
Capillary ; Wedge
Die Collet ; Needle
Copper Bonding Wire
Supporting System
MFC & MFM
FM &FC
Gas Purifer
Gas Scrubber
Gas Cabinet
Chiller
Solar Cell / Other
Solar Cell
Laser Scribing Machine
Laser Machine
Specialty Gas (F2/SF6)
Specialty Gas (SiF4/CH4)
Specialty Gas (NH3/DEZ)
SiC Powder
Chemical HF
Specialty Gas (COF2)
Other
Aerogel
CDP Dryer
The parts of PI & PBI
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Solar Cell / Other
Solar Cell
Laser Scribing Machine
Laser Machine
Specialty Gas (F2/SF6)
Specialty Gas (SiF4/CH4)
Specialty Gas (NH3/DEZ)
SiC Powder
Chemical HF
Specialty Gas (COF2)
Other
Aerogel
CDP Dryer
The parts of PI & PBI
關於NICHING
產品介紹
投資人服務
菁英招募
利機新聞
聯絡方式
利機企業股份有限公司 / 台中市西屯區中港路三段97號5樓之5 / TEL:04-23588966
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